Printing Conductive Lines and Surfaces on Different Substrates Using Inkjet Printing Method
Subject Areas : electrical and computer engineeringJ. Nouri 1 , S. M. Bidoki 2 , A. A. Heidari 3
1 -
2 -
3 -
Keywords: Inkjet printing metal deposition conductive textile printed electronics printing circuit components,
Abstract :
Printing technology is known as one of the most suitable methods for adding electrical functionalities to textiles and inkjet method because of advantages such as low cost, availability, flexibility, … is a special method amongst all available printing techniques. This is the objective of this research to employ the novel method of using reactive inks in order to react with each other after being jetted onto the substrate for fabrication of simple electric circuit components. In this method, dilute solution of silver salt and a reducing solution are subsequently printed on each substrate. Oxidation-Reduction reaction between two inks deposits metallic silver nanoparticles by in situ reduction of silver salt forming an electrically conductive surface. The best reducing agent for inkjet deposition of silver was found to be ascorbic acid at normal pH. Conductive lines and patterns were fabricated on paper, plastic films and textile fabrics using the above technique and the effect of different parameters on their final conductivity were investigated and tried to gain the highest possible conductivities on each substrate. Based on our observations and results; inkjet technology posses very high potential for fabrication of silver nanoparticles containing patterns with conductivities up to 5x105 S/m for use as circuitry components.
[1] S. M. Bidoki, Using Nanotechnology in the Chemical Deposition of Conductive Patterns on Textiles and Flexible Substrates, Ph.D. Thesis, University of Leeds, Oct. 2006.
[2] S. M. Bidoki, D. Mcgorman, D. M. Lewis, M. Clark, G. Horler, and R. E. Miles, "Ink-jet printing of conductive patterns on textiles fabrics," University of Leeds, AATCC Review, vol. 5, no. 6, pp. 11-13, Jun. 2005.
[3] Ink-Jet and Bubble-Jet Printers Technology, Printers technology guide from Micromechanic. Available at http://mimech.com/printers/inkjet-printer-technology.asp
[4] S. M. Bidoki, D. M. Lewis, M. Clark, A. Vakorov, P. A. Millner, and D. Mcgorman, "Ink-jet fabrication of electronic components," J. of Micromechanics and Microengineering, (IOP), vol. 17, no. 5, pp. 967-974, May 2007.
[5] L. Smith, Development of Direct Write Ink-Jet for Deposition of Silver Contacts, Department of Energy; Energy Research Undergraduate Laboratory Fellowship Program, University of California Santa Cruz National Renewable Energy Laboratory, Golden, Colorado, Jul. 2001.
[6] G. Hideyuki, U. Masayuki, M. Yorishige, and H. Noriaki, Method for Forming Circuit Pattern Utilizing Ink-Jet Printing Method, Japanese Patent JP 20010125967, 2002.
[7] L. Leenders and L. Oelbrandt, Process for the Production of Printing Plate by Ink-Jet, European Patent EP 0697282 B1, 1998.
[8] R. D. Johnson and W. N. Damarel, Deposition Solid Materials, World Patent WO03049515, 2003.
[9] J. S. Miller, Ink-Jet Printing of Printed Circuit Boards, United States Patent US4668533, May 2007.
[10] V. D. B. Jan Guido, D. Leo, and L. O. Luc, Process for the Production of a Printing Plate by Ink-Jet, European Patent EP0697282, 1996.
[11] K. Paulose, N. A. Lawrence, G. M. Stevens, and R. Driver, Electroless Deposition of Metallic Coatings on Non-Conducting Substances, Word Patent WO9721849, Jun. 1997.
[12] M. Huske and J. Kikelhain, Miniaturization of Electronic Components: a New Manufacturing Process for 3D-MIDS, http://www.ptbmagazine.com, Oct. 2002.
[13] B. Thomas, E. Lars, and M. Per, A Method and a Device for Deposition of a Metal Layer on a Non-Conducting Surface of a Substrate, World Patent WO2005087979, Sep. 2005.
[14] E. Kunnari, J. Valkama, M. Keskinen, and P. Mansikkamaki, "Environmental evaluation of new technology: printed electronics case study," J. of Cleaner Production, vol. 17, no. 9, pp. 791-799, Jun. 2009.
